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Brand Name : HUASWIN
Model Number : HSPCBA1046
Certification : ISO/UL/RoHS
Place of Origin : China
MOQ : 1 sets
Price : Negotiation
Payment Terms : T/T, Western Union, L/C
Supply Ability : 10,000pcs per month
Delivery Time : 15-20 working days
Packaging Details : Anti-static bag + Anti-static bubble wrap + Good quality carton box
Custom SMT BGA PCB Printed Circuit Board Assembly AOI Testing
Specifications
1. PCB design & fabrication
2. Material Sourcing Service
3. SMD assembly and Through hole components insertion
4. IC pre-programming / Burning on-line
5. Function testing as requested
6. Complete Unit assembly ( which including plastics, metal box, Coil, cable inside etc)
7. Packing design
Our advanced equipment, process flows in SMT, DIP assembly and high Standard Operation Procedure (SOP) are the fundamental assurance of providing high quality assembly service. The excellent soldering skills to our experienced employee on the production line, and the comfortable clean working environment ensures the quality of our strong processing capacity.
All of our products are produced under strictly observation of the ISO9001: 2000 and conform to the ROHS standard. We always take customer's satisfaction as our principle pursuit, " Good quality with reasonable price", "Quick delivery".
PCB Assembly services:
SMT Assembly
Automatic Pick & Place 
Component Placement as Small as 0201 
Fine Pitch QEP - BGA 
Automatic Optical Inspection 
Through-hole Assembly 
Wave Soldering 
Hand Assembly and Soldering 
Material Sourcing 
IC pre-programming / Burning on-line 
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design
Testing Methods
AOI Testing
Checks for solder paste 
Checks for components down to 0201" 
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of: 
BGAs 
Bare boards 
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by 
component problems. 
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing
Design file format:
 
1. Gerber RS-274X, 274D, Eagle and AutoCAD's DXF, DWG
2. BOM (bill of materials)
3. Pick and place file (XYRS)
 
Advantages:
 
1. Turnkey manufacturing or quick-turn prototypes
2. Board-level assembly or complete system integration
3. Low-volume or mixed-technology assembly for PCBA
4. Even consignment production
5. Supported capabilities 
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